标题: Apple COO Visits Foxconn's 3D Printing Line for Micron-Level iPhone Duo Hinge Manufacturing [打印本页] 作者: admin 时间: 2026-10-13 20:09 标题: Apple COO Visits Foxconn's 3D Printing Line for Micron-Level iPhone Duo Hinge Manufacturing On October 13, 2026, Nanjixiong learned that Apple Chief Operating Officer Sabih Khan visited Foxconn in Zhengzhou on October 11 to inspect automated, micron-level 3D printing equipment for the foldable iPhone Duo.
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Apple and Foxconn jointly customized the equipment specifically for the iPhone Duo, redesigning processes for more than one hundred precision components around the hinge. Confocal laser scanning generates a 3D contour map layer by layer, and machine-learning algorithms produce an immediate, dynamically adjusted filling strategy. Up to 25 layers of customized photopolymer spray coating control hinge flatness at the micron level, addressing the underlying causes of screen creasing.
Preorders for the iPhone Duo will open on October 16. Khan said the Zhengzhou campus combines large-scale production, quality control and complex product manufacturing capabilities, reflecting Apple's long-standing collaboration with Chinese supply-chain partners.
Nanjixiong's observation
3D printing is moving from prototyping into consumer electronics production. Additive processes in the hinge of Apple's first foldable phone represent deeper adoption in advanced manufacturing.
Source: Jiemian News, October 12, 2026.
AI-translated from an article by Kuaixiong on Nanjixiong, originally published on 2026-10-13. Text and images retain the original source attribution. Read the original Chinese article
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