Source: PanDen
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The 2025 Formnext Shenzhen exhibition drew more than 20,000 professionals onsite, while Panda3dp.com’s live broadcast of the event attracted over 34,000 online viewers.
At the booth of global 3D printing giant HP, Panda3dp.com interviewed Zhao Hua, head of HP’s 3D printing business in China, who shared insights on the highlights and applications showcased this year. Zhao emphasized a key trend: the vast majority of exhibits were drawn from successful applications by Chinese and Asian clients—underscoring the deepening maturity and localization of HP’s 3D printing technology in China.
1. Polymer Printing: From Smart Hardware to Medical Rehabilitation
In the polymer section, HP highlighted how its Multi Jet Fusion (MJF) technology addresses the manufacturing needs of variety-rich, small-batch, rapid customization while reducing inventory. Representative applications included:
Smart Hardware / Consumer Electronics: Components such as smart speaker housings, where precision and surface quality meet end-use standards, effectively replacing traditional injection molding. Automotive Soft Components: Prototype automotive tubing and other parts printed with TPU and TPA elastomers, meeting the urgent demand for flexible components during late-stage development.
Medical Rehabilitation – White Nylon: A major highlight was a scoliosis orthosis developed with a leading domestic brand using HP’s latest 5620 series and new white nylon 12 material. This “medical white” material retains nylon’s toughness, smooth surface, and consistency while achieving a pure white tone that simplifies post-processing such as painting—offering a superior solution for rehabilitation devices.
2. Metal Binder Jetting (BJ): Focusing on Hydraulics, Thermal Management, and Niche Small-Batch Markets
In the metal printing area, HP showcased applications of its distinctive binder jetting technology, capable of producing each layer in just 12 seconds—well-suited for volume manufacturing. Cases included:
Hydraulic Systems: Stainless steel hydraulic valve blocks and similar parts widely used in mining machinery, processed and treated for direct end-use installation. Pure Copper Heat Sinks: A new solution for liquid-cooled thermal management in 3C electronics and servers. Binder jetting unlocks new design freedom and performance advantages in heat dissipation.
High-Frequency, Small-Batch Orders: Zhao noted a key domestic application niche—markets where orders are frequent but limited to a few hundred or thousand pieces per batch. This aligns with industries such as golf equipment, jewelry, and specialty thermal products. China’s strong post-processing and materials R\&D capabilities, combined with HP’s open materials platform, are fueling such innovations.
3. Service Provider Ecosystem and Installed Base: Clear Market Concentration
Addressing the industry’s interest in installed base, Zhao revealed:
HP 3D printers (polymer and metal) have already reached several hundred units installed in China, and several thousand globally. Service providers are the main purchasers domestically. Among them, the top 20 providers account for a large share, with the top five holding nearly 100 machines combined, and the top two alone operating around 50. This reflects HP’s competitive edge in high-efficiency, high-consistency, rapid-delivery, and stable-quality production—ideal for large-scale, batch manufacturing of end-use parts.
4. Strategic Focus in the 3C Sector: Three Priority Directions
When asked about applications in the booming 3C electronics sector, Zhao revealed HP’s strategic emphasis on three distinct areas of scarcity-driven value:
Stainless Steel Structural Components: Leveraging BJ’s superior surface finish to target visible components such as casings and frames for wearables, meeting stringent aesthetic standards with reduced carbon footprint. Refractory and Specialty Metals: Harnessing BJ’s versatility to process uncommon, hard-to-machine materials for niche applications. Thermal Management Solutions: Continuing to advance pure copper heat sink applications—HP’s most competitive strength in the 3C market.
Through this exhibition, HP delivered a clear message: its 3D printing technology is firmly rooted in China, strengthened by localized material development, process optimization, and application innovation. By partnering with leading service providers, HP has fostered a powerful ecosystem for scaled manufacturing. Looking forward, HP intends to sharpen its focus—not on being all-encompassing, but on excelling in high-volume, high-consistency production fields, particularly in 3C electronics, medical, and automotive high-end manufacturing. |