eSUN Launches ABS-ESD Filament to Meet Precision Electronics and IC Static Protection Needs

September 23, 2025 — Panda3dp.com reports that eSUN has released a new anti-static filament, ABS-ESD, designed to meet the stringent requirements of precision electronics and integrated circuit (IC) protection. The surface resistivity of ABS-ESD can be flexibly adjusted between 10⁶ and 10¹⁰ Ω by fine-tuning the printing temperature, allowing users to switch between low- and high-efficiency anti-static modes to suit a wide range of ESD protection applications. The material also offers a heat deflection temperature above 90°C (under 0.45 MPa), ensuring dual protection for sensitive electronic components.

Deep Anti-Dust Resistance, Durable and Wear-Resistant

ABS-ESD effectively prevents dust accumulation caused by static electricity during equipment operation, thereby reducing static charge sources while retaining the excellent strength and toughness of standard ABS. The material withstands frequent friction and mechanical handling without significant wear or breakage, ensuring safe assembly and transportation of electronic devices.

High Precision Printing with Low Warping

During 3D printing, ABS-ESD exhibits stable molding, minimal warping, and a smooth surface finish, making it suitable for fabricating complex ESD-protection structures such as fixtures, robotic end effectors, and turnover boxes.

Comprehensive Performance for Industrial Applications

Overall, ABS-ESD is a permanently anti-static modified material offering surface resistivity as low as 10⁵ Ω, smooth printability, and a balanced combination of strength, stiffness, and toughness. With its high heat resistance and reliable static protection, it is ideal for precision electronics, integrated circuits, and packaging applications requiring robust and long-term ESD control.