SiC Ceramic 3D Printing for Advanced Thermal Management — Guohong Tianyi Introduces a New High-Conductivity, Lightweight Solution

October 29, 2025 — Panda3dp.com Exclusive
Driven by the rapid rise of AI computing, the demand for GPU thermal management has surged dramatically. While metal 3D-printed heat exchangers are already attracting widespread attention, ceramic 3D-printed cooling systems are now emerging as the next frontier.

SiC Ceramics: A Next-Generation Thermal Solution

In fields such as high-end chips, 5G/6G base stations, aerospace electronics, and high-power IGBT modules, heat dissipation has become the critical bottleneck restricting performance improvement. Traditional metal heat sinks are constrained by limited thermal conductivity and design flexibility, making them unsuitable for high power density devices.

Silicon carbide (SiC) ceramics, with their superior thermal conductivity (≥150 W/(m·K)), low thermal expansion, high mechanical strength, and lightweight characteristics, have become the ideal material for next-generation high-efficiency thermal components.

However, due to the complexity of forming and machining SiC ceramics, the industrialization of high-performance SiC thermal components has long remained a challenge — until now.

Full-Process Breakthrough: From Material Formulation to High-Precision Printing

Xi’an Guohong Tianyi Intelligent Technology Co., Ltd. has achieved a complete technological breakthrough using its independently developed ceramic photopolymerization 3D printing process combined with high-performance SiC slurry formulations.

This innovation enables an end-to-end manufacturing workflow — from material design and structure optimization to 3D printing and sintering — delivering complex, high-precision, high-performance SiC thermal components at an industrial scale.

(Image: Guohong Tianyi Ceramic Photopolymerization 3D Printer JH-C420)

1. High-Precision Fabrication of Complex 3D Multi-Chamber Structures

Traditional manufacturing methods cannot realize integrated, multi-chamber or fractal cooling geometries. In contrast, Guohong Tianyi’s JH-C250 high-precision photopolymerization system enables stable production of the following advanced structures:

· Non-circular microchannels (e.g., Gyroid surfaces, bionic topologies)

· Multi-stage branched flow networks

· High aspect ratio microchannels (depth ratio ≥ 10:1)

· Sealed cavities and porous composite cooling structures

“Guohong Tianyi has not only achieved the leap from ‘impossible to possible,’ but more importantly, from ‘possible to precise,’”
said the company’s Technical Director.

Currently, the process achieves ±0.05 mm dimensional precision and post-sintering deformation under 0.2%, meeting the assembly requirements of precision electronics.

2. Industrial-Grade Performance and Proven Batch Consistency

Industrial adoption depends on repeatable material properties and process stability. According to Guohong Tianyi’s test data, 3D-printed SiC components have reached the following performance benchmarks:

These results demonstrate that additively manufactured SiC ceramics now match or exceed traditionally processed materials — while offering vastly greater design freedom.

(Image: SiC liquid-cooled plate, tested at 100 °C)

3. Tailored Thermal Solutions for Demanding Applications

Guohong Tianyi has partnered with leading companies in communications, aerospace, and power electronics to deliver custom SiC ceramic heat sinks and cooling plates, targeting applications such as:

· 5G/6G power amplifier cooling modules

· Aerospace avionics cold plates

· EV IGBT module substrates

· High-end GPU/CPU liquid-cooling systems

Through topology optimization and thermal-fluid simulation, each design is precisely tuned to the heat source and operating environment, achieving uniform temperature distribution and higher cooling efficiency.

(Image: Integrated SiC cooling structure)

4. Design–Manufacturing Integration: Shorter R&D Cycles

The technology grants engineers far greater freedom to perform Design for Additive Manufacturing (DfAM) — tailoring channel geometry, flow paths, and material thickness according to heat source layout and spatial constraints.

The result:

· Radically shortened development cycles — from concept to prototype in one-third the time of traditional methods.

· Faster iteration and cost-efficient customization, accelerating innovation across multiple industries.

Conclusion

The SiC ceramic additive manufacturing technology pioneered by Xi’an Guohong Tianyi is transitioning from laboratory innovation to full industrial application. It enables the production of complex, high-performance, and highly reliable thermal management components for power electronics, telecommunications, and aerospace systems.

As material performance and process stability continue to improve, SiC ceramic 3D printing is poised to become a key technological pathway for the next generation of high-efficiency thermal management solutions.