Aixway3D: Ushering in a New Era of AI Thermal Management with Micron-Scale Metal 3D Printing

As artificial intelligence continues its rapid ascent, the ever-growing computational demand is turning heat into the critical bottleneck of modern technology systems. From GPU clusters in data centers to chip packaging for autonomous driving, efficient heat dissipation within increasingly compact spaces has become one of the AI industry’s toughest engineering challenges.

In this emerging “thermal revolution,” Aixway3D, an innovative company based in Taicang, Jiangsu, is reshaping the design boundaries of heat management through its micron-scale metal 3D printing technology.

From Fraunhofer to Taicang: German Heritage, Chinese Innovation

The core team of Aixway3D hails from the Fraunhofer Institute for Laser Technology (ILT) in Germany—the birthplace of modern Laser Powder Bed Fusion (LPBF/SLM) technology, first developed in 1995 by Dr. Wilhelm Meiners, known as the “Father of Metal 3D Printing.” Aixway3D’s founder, Dr. Liyao Wei Shen, is Dr. Meiners’ only Chinese protégé, inheriting a legacy of academic rigor and deep technical expertise in metal printing precision, materials science, and system integration.

Conventional LPBF systems typically achieve 80–200 μm resolution with surface roughness of Ra 5–20 μm, insufficient for high-precision heat dissipation structures. Aixway3D’s proprietary micron-scale metal printing process reduces feature size to 5 μm or below, with surface roughness reaching Ra 0.8–2.8 μm—equivalent to CNC machining quality. This breakthrough allows components to be directly integrated into end-use assemblies without extensive post-processing, forming the foundation for lightweight, microstructured, and high-conductivity thermal components.

Reengineering Heat Flow: From Planar Dissipation to 3D Capillary Networks

Traditional copper or aluminum heat sinks are confined to 2D planar conduction due to machining limitations, making the fabrication of intricate fluid channels and capillary structures nearly impossible. Aixway3D’s micron-scale 3D printing enables the seamless integration of multi-layered curved channels and three-dimensional capillary networks, achieving unprecedented control over heat transfer pathways.

In one test, ultra-thin water-cooling plates (0.8–1.8 mm thick) incorporated micro-scale flow channels and absorbent lattice grids, resulting in dramatically improved heat exchange density and thermal efficiency. Compared with a conventional copper IGBT water-cooling plate, Aixway3D’s 316L stainless steel module reduced weight by 96%, volume by 75%, and material cost by USD 500, while doubling heat dissipation efficiency.

This combination of lightweight and high-performance characteristics makes the technology ideal for AI servers, power semiconductor modules, and electric vehicle control systems, where space and thermal density are critical.

Self-Driven Capillary Circulation: Turning Heat into Motion

In 2024, Aixway3D introduced another major breakthrough: the self-wicking porous metal lattice, pushing the limits of passive thermal management.

This structure features 30 μm rods spaced at 60 μm intervals, forming a precise capillary network within 316L stainless steel. Through capillary action, liquid can spontaneously circulate—absorbing heat at the hot end, evaporating, and then condensing at the cold end before returning through the microchannels—creating a pump-free, closed-loop heat transfer system akin to a self-contained heat pipe.

Experimental results showed that the lattice achieved 30 mm of liquid climb within just 8 seconds, demonstrating exceptional hydrophilicity and efficient thermal recirculation. This active capillary cycle presents new design opportunities for AI chip liquid cooling, 5G thermal modules, and even spacecraft thermal control systems.

Reliability Proven: 30,000 Hours of Corrosion-Free Performance

Reliability and longevity are key to industrial adoption. Aixway3D’s micron-scale cooling plates have undergone 21,000 hours of accelerated lab testing and 30,000+ hours of customer field operation, showing zero internal corrosion or structural degradation.

Such durability stems from its nearly 100% density and precise metallurgical control, which minimize microcracks and stress-corrosion risks common in cast or welded components. The company has also expanded its material portfolio beyond 316L stainless steel to include nickel-based alloys, titanium, and copper, balancing thermal conductivity, oxidation resistance, and corrosion durability.

From Lab Innovation to Industrialization: Reaching the Manufacturing Turning Point

Aixway3D’s technological achievements mark a decisive shift from research-grade printing to scalable industrial production. Its support-free fabrication capability (printing unsupported structures above 10°) and high-precision surface finish enable complex thermal components to be produced in a single print, ready for direct use, dramatically reducing R&D and iteration cycles.

The company is also building a standardized production ecosystem, collaborating with domestic AI hardware and laser equipment manufacturers to co-develop mass-producible thermal management solutions for next-generation computing infrastructure.

Conclusion: The Future of AI Cooling Lies in the Micron Realm

In the age of AI, thermal management is no longer just a matter of physical conduction—it is a revolution in manufacturing methodology. Aixway3D’s micron-scale metal 3D printing transforms heat dissipation from a stacked design model into an integrated, “structure-as-function” paradigm.

When a 30 μm capillary network operates seamlessly within a millimeter-scale component, the very path of heat flow is redefined. In the near future, such microstructured metallic cooling architectures, born from additive manufacturing, are poised to become the core solution for next-generation AI hardware thermal management.